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Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys

Identifieur interne : 000E69 ( Main/Repository ); précédent : 000E68; suivant : 000E70

Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys

Auteurs : RBID : Pascal:13-0016958

Descripteurs français

Pascal (Inist)
- Addition argent, Addition indium, Propriété mécanique, Indentation, Fluage, Solidification rapide, Filage état liquide, Méthode résonance, Alliage eutectique, Réseau rhomboédrique, Alliage ternaire, Assemblage brasage tendre, Résistance fluage, Résistance mécanique, Composé intermétallique, Solution solide, Alliage base bismuth, Etain alliage, Point fusion, Durcissement, Renforcement mécanique, Constante élasticité, Frottement interne, Propriété thermique, Effet contrainte, Relation composition propriété, Substrat indium, Ag3Sn, 8140L, 8130F, Brasure sans plomb.

English descriptors

KwdEn :
- Bismuth base alloys, Creep, Creep strength, Elastic constant, Eutectic alloy, Hardening, Indentation, Indium addition, Intermetallic compound, Internal friction, Lead free solder, Mechanical properties, Melt spinning, Melting point, Property composition relationship, Rapid solidification, Resonance technique, Silver addition, Soldered joint, Solid solution, Strength, Strengthening, Stress effects, Ternary alloy, Thermal properties, Tin alloy, Trigonal lattices.

Abstract

Mechanical properties and indentation creep of the melt-spun process Bi-42 wt%Sn, Bi-40 wt%Sn-2 wt%In, Bi-40 wt%Sn-2 wt%Ag and Bi-38 wt%Sn-2 wt%In-2 wt%Ag were studied by dynamic resonance technique and Vickers indentation testing at room temperature and compared to that of the traditional Sn-37 wt%Pb eutectic alloy. The results show that the structure of Bi-42 wt%Sn alloy is characterized by the presence of rhombohedral Bi and body centered tetragonal β-Sn. The two ternary alloys exhibit additional constituent phases of intermetallic compounds SnIn₁₉ for Bi-40 wt%Sn-2 wt%In and ε-Ag₃Sn for Bi-40 wt%Sn-2 wt%Ag alloys. Attention has been paid to the role of intermetallic compounds on mechanical and creep behavior. The In and Ag containing solder alloy exhibited a good combination of higher creep resistance, good mechanical properties and lower melting temperature as compared with Pb-Sn eutectic solder alloy. This was attributed to the strengthening effect of Bi as a strong solid solution element in the Sn matrix and formation of intermetallic compounds β-SnBi, ε-Ag₃Sn and InSn₁₉ which act as both strengthening agent and grain refiner in the matrix of the material. Addition of In and Ag decreased the melting temperature of Bi-Sn lead-free solder from 143 °C to 133 °C which was possible mainly due to the existence of InSn₁₉ and Ag₃Sn intermetallic compounds. Elastic constants, internal friction and thermal properties of Bi-Sn based alloys have been studied and analyzed.

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<author><name>RIZK MOSTAFA SHALABY</name>
<affiliation wicri:level="1"><inist:fA14 i1="01"><s1>Mansoura University, Metal Physics Lab., Physics Department, Faculty of Science, Al-Gomhouria Street, Mansoura, P.O.Box 35516</s1>
<s3>EGY</s3>
<sZ>1 aut.</sZ>
</inist:fA14>
<country>Égypte</country>
<wicri:noRegion>Mansoura University, Metal Physics Lab., Physics Department, Faculty of Science, Al-Gomhouria Street, Mansoura, P.O.Box 35516</wicri:noRegion>
</affiliation>
</author>
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<publicationStmt><idno type="inist">13-0016958</idno>
<date when="2013">2013</date>
<idno type="stanalyst">PASCAL 13-0016958 INIST</idno>
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<seriesStmt><idno type="ISSN">0921-5093</idno>
<title level="j" type="abbreviated">Mater. sci. eng. A Struct. mater. prop. microstruct. proces.</title>
<title level="j" type="main">Materials science & engineering. A, Structural materials : properties, microstructure and processing</title>
</seriesStmt>
</fileDesc>
<profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Bismuth base alloys</term>
<term>Creep</term>
<term>Creep strength</term>
<term>Elastic constant</term>
<term>Eutectic alloy</term>
<term>Hardening</term>
<term>Indentation</term>
<term>Indium addition</term>
<term>Intermetallic compound</term>
<term>Internal friction</term>
<term>Lead free solder</term>
<term>Mechanical properties</term>
<term>Melt spinning</term>
<term>Melting point</term>
<term>Property composition relationship</term>
<term>Rapid solidification</term>
<term>Resonance technique</term>
<term>Silver addition</term>
<term>Soldered joint</term>
<term>Solid solution</term>
<term>Strength</term>
<term>Strengthening</term>
<term>Stress effects</term>
<term>Ternary alloy</term>
<term>Thermal properties</term>
<term>Tin alloy</term>
<term>Trigonal lattices</term>
</keywords>
<keywords scheme="Pascal" xml:lang="fr"><term>Addition argent</term>
<term>Addition indium</term>
<term>Propriété mécanique</term>
<term>Indentation</term>
<term>Fluage</term>
<term>Solidification rapide</term>
<term>Filage état liquide</term>
<term>Méthode résonance</term>
<term>Alliage eutectique</term>
<term>Réseau rhomboédrique</term>
<term>Alliage ternaire</term>
<term>Assemblage brasage tendre</term>
<term>Résistance fluage</term>
<term>Résistance mécanique</term>
<term>Composé intermétallique</term>
<term>Solution solide</term>
<term>Alliage base bismuth</term>
<term>Etain alliage</term>
<term>Point fusion</term>
<term>Durcissement</term>
<term>Renforcement mécanique</term>
<term>Constante élasticité</term>
<term>Frottement interne</term>
<term>Propriété thermique</term>
<term>Effet contrainte</term>
<term>Relation composition propriété</term>
<term>Substrat indium</term>
<term>Ag3Sn</term>
<term>8140L</term>
<term>8130F</term>
<term>Brasure sans plomb</term>
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<front><div type="abstract" xml:lang="en">Mechanical properties and indentation creep of the melt-spun process Bi-42 wt%Sn, Bi-40 wt%Sn-2 wt%In, Bi-40 wt%Sn-2 wt%Ag and Bi-38 wt%Sn-2 wt%In-2 wt%Ag were studied by dynamic resonance technique and Vickers indentation testing at room temperature and compared to that of the traditional Sn-37 wt%Pb eutectic alloy. The results show that the structure of Bi-42 wt%Sn alloy is characterized by the presence of rhombohedral Bi and body centered tetragonal β-Sn. The two ternary alloys exhibit additional constituent phases of intermetallic compounds SnIn<sub>19</sub>
 for Bi-40 wt%Sn-2 wt%In and ε-Ag<sub>3</sub>
Sn for Bi-40 wt%Sn-2 wt%Ag alloys. Attention has been paid to the role of intermetallic compounds on mechanical and creep behavior. The In and Ag containing solder alloy exhibited a good combination of higher creep resistance, good mechanical properties and lower melting temperature as compared with Pb-Sn eutectic solder alloy. This was attributed to the strengthening effect of Bi as a strong solid solution element in the Sn matrix and formation of intermetallic compounds β-SnBi, ε-Ag<sub>3</sub>
Sn and InSn<sub>19</sub>
 which act as both strengthening agent and grain refiner in the matrix of the material. Addition of In and Ag decreased the melting temperature of Bi-Sn lead-free solder from 143 °C to 133 °C which was possible mainly due to the existence of InSn<sub>19</sub>
 and Ag<sub>3</sub>
Sn intermetallic compounds. Elastic constants, internal friction and thermal properties of Bi-Sn based alloys have been studied and analyzed.</div>
</front>
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<fA08 i1="01" i2="1" l="ENG"><s1>Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys</s1>
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<fA11 i1="01" i2="1"><s1>RIZK MOSTAFA SHALABY</s1>
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<fA14 i1="01"><s1>Mansoura University, Metal Physics Lab., Physics Department, Faculty of Science, Al-Gomhouria Street, Mansoura, P.O.Box 35516</s1>
<s3>EGY</s3>
<sZ>1 aut.</sZ>
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<fC01 i1="01" l="ENG"><s0>Mechanical properties and indentation creep of the melt-spun process Bi-42 wt%Sn, Bi-40 wt%Sn-2 wt%In, Bi-40 wt%Sn-2 wt%Ag and Bi-38 wt%Sn-2 wt%In-2 wt%Ag were studied by dynamic resonance technique and Vickers indentation testing at room temperature and compared to that of the traditional Sn-37 wt%Pb eutectic alloy. The results show that the structure of Bi-42 wt%Sn alloy is characterized by the presence of rhombohedral Bi and body centered tetragonal β-Sn. The two ternary alloys exhibit additional constituent phases of intermetallic compounds SnIn<sub>19</sub>
 for Bi-40 wt%Sn-2 wt%In and ε-Ag<sub>3</sub>
Sn for Bi-40 wt%Sn-2 wt%Ag alloys. Attention has been paid to the role of intermetallic compounds on mechanical and creep behavior. The In and Ag containing solder alloy exhibited a good combination of higher creep resistance, good mechanical properties and lower melting temperature as compared with Pb-Sn eutectic solder alloy. This was attributed to the strengthening effect of Bi as a strong solid solution element in the Sn matrix and formation of intermetallic compounds β-SnBi, ε-Ag<sub>3</sub>
Sn and InSn<sub>19</sub>
 which act as both strengthening agent and grain refiner in the matrix of the material. Addition of In and Ag decreased the melting temperature of Bi-Sn lead-free solder from 143 °C to 133 °C which was possible mainly due to the existence of InSn<sub>19</sub>
 and Ag<sub>3</sub>
Sn intermetallic compounds. Elastic constants, internal friction and thermal properties of Bi-Sn based alloys have been studied and analyzed.</s0>
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<fC02 i1="05" i2="X"><s0>240</s0>
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<fC03 i1="01" i2="X" l="FRE"><s0>Addition argent</s0>
<s5>01</s5>
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<fC03 i1="01" i2="X" l="ENG"><s0>Silver addition</s0>
<s5>01</s5>
</fC03>
<fC03 i1="01" i2="X" l="GER"><s0>Silberzusatz</s0>
<s5>01</s5>
</fC03>
<fC03 i1="01" i2="X" l="SPA"><s0>Adición plata</s0>
<s5>01</s5>
</fC03>
<fC03 i1="02" i2="X" l="FRE"><s0>Addition indium</s0>
<s5>02</s5>
</fC03>
<fC03 i1="02" i2="X" l="ENG"><s0>Indium addition</s0>
<s5>02</s5>
</fC03>
<fC03 i1="02" i2="X" l="GER"><s0>Indiumzusatz</s0>
<s5>02</s5>
</fC03>
<fC03 i1="02" i2="X" l="SPA"><s0>Adición indio</s0>
<s5>02</s5>
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<s5>03</s5>
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<s5>03</s5>
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<fC03 i1="03" i2="X" l="SPA"><s0>Propiedad mecánica</s0>
<s5>03</s5>
</fC03>
<fC03 i1="04" i2="X" l="FRE"><s0>Indentation</s0>
<s5>04</s5>
</fC03>
<fC03 i1="04" i2="X" l="ENG"><s0>Indentation</s0>
<s5>04</s5>
</fC03>
<fC03 i1="04" i2="X" l="SPA"><s0>Indentación</s0>
<s5>04</s5>
</fC03>
<fC03 i1="05" i2="X" l="FRE"><s0>Fluage</s0>
<s5>05</s5>
</fC03>
<fC03 i1="05" i2="X" l="ENG"><s0>Creep</s0>
<s5>05</s5>
</fC03>
<fC03 i1="05" i2="X" l="GER"><s0>Kriechen</s0>
<s5>05</s5>
</fC03>
<fC03 i1="05" i2="X" l="SPA"><s0>Fluencia</s0>
<s5>05</s5>
</fC03>
<fC03 i1="06" i2="X" l="FRE"><s0>Solidification rapide</s0>
<s5>06</s5>
</fC03>
<fC03 i1="06" i2="X" l="ENG"><s0>Rapid solidification</s0>
<s5>06</s5>
</fC03>
<fC03 i1="06" i2="X" l="GER"><s0>Rasches Erstarren</s0>
<s5>06</s5>
</fC03>
<fC03 i1="06" i2="X" l="SPA"><s0>Solidificación rápido</s0>
<s5>06</s5>
</fC03>
<fC03 i1="07" i2="X" l="FRE"><s0>Filage état liquide</s0>
<s5>07</s5>
</fC03>
<fC03 i1="07" i2="X" l="ENG"><s0>Melt spinning</s0>
<s5>07</s5>
</fC03>
<fC03 i1="07" i2="X" l="GER"><s0>Schmelzspinnverfahren</s0>
<s5>07</s5>
</fC03>
<fC03 i1="07" i2="X" l="SPA"><s0>Hilado estado líquido</s0>
<s5>07</s5>
</fC03>
<fC03 i1="08" i2="X" l="FRE"><s0>Méthode résonance</s0>
<s5>08</s5>
</fC03>
<fC03 i1="08" i2="X" l="ENG"><s0>Resonance technique</s0>
<s5>08</s5>
</fC03>
<fC03 i1="08" i2="X" l="GER"><s0>Resonanzverfahren</s0>
<s5>08</s5>
</fC03>
<fC03 i1="08" i2="X" l="SPA"><s0>Método resonancia</s0>
<s5>08</s5>
</fC03>
<fC03 i1="09" i2="X" l="FRE"><s0>Alliage eutectique</s0>
<s5>09</s5>
</fC03>
<fC03 i1="09" i2="X" l="ENG"><s0>Eutectic alloy</s0>
<s5>09</s5>
</fC03>
<fC03 i1="09" i2="X" l="GER"><s0>Eutektische Legierung</s0>
<s5>09</s5>
</fC03>
<fC03 i1="09" i2="X" l="SPA"><s0>Aleación eutéctica</s0>
<s5>09</s5>
</fC03>
<fC03 i1="10" i2="3" l="FRE"><s0>Réseau rhomboédrique</s0>
<s5>10</s5>
</fC03>
<fC03 i1="10" i2="3" l="ENG"><s0>Trigonal lattices</s0>
<s5>10</s5>
</fC03>
<fC03 i1="11" i2="X" l="FRE"><s0>Alliage ternaire</s0>
<s5>11</s5>
</fC03>
<fC03 i1="11" i2="X" l="ENG"><s0>Ternary alloy</s0>
<s5>11</s5>
</fC03>
<fC03 i1="11" i2="X" l="SPA"><s0>Aleación ternaria</s0>
<s5>11</s5>
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<fC03 i1="12" i2="X" l="FRE"><s0>Assemblage brasage tendre</s0>
<s5>12</s5>
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<fC03 i1="12" i2="X" l="ENG"><s0>Soldered joint</s0>
<s5>12</s5>
</fC03>
<fC03 i1="12" i2="X" l="GER"><s0>Weichloetverbindung</s0>
<s5>12</s5>
</fC03>
<fC03 i1="12" i2="X" l="SPA"><s0>Junta soldada</s0>
<s5>12</s5>
</fC03>
<fC03 i1="13" i2="X" l="FRE"><s0>Résistance fluage</s0>
<s5>13</s5>
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<fC03 i1="13" i2="X" l="ENG"><s0>Creep strength</s0>
<s5>13</s5>
</fC03>
<fC03 i1="13" i2="X" l="GER"><s0>Kriechfestigkeit</s0>
<s5>13</s5>
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<fC03 i1="13" i2="X" l="SPA"><s0>Resistencia a la fluencia</s0>
<s5>13</s5>
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<s5>14</s5>
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<fC03 i1="14" i2="X" l="ENG"><s0>Strength</s0>
<s5>14</s5>
</fC03>
<fC03 i1="14" i2="X" l="GER"><s0>Festigkeit</s0>
<s5>14</s5>
</fC03>
<fC03 i1="14" i2="X" l="SPA"><s0>Resistencia mecánica</s0>
<s5>14</s5>
</fC03>
<fC03 i1="15" i2="X" l="FRE"><s0>Composé intermétallique</s0>
<s5>15</s5>
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<fC03 i1="15" i2="X" l="ENG"><s0>Intermetallic compound</s0>
<s5>15</s5>
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<s5>15</s5>
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<s5>15</s5>
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<fC03 i1="16" i2="X" l="FRE"><s0>Solution solide</s0>
<s5>16</s5>
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<s5>16</s5>
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<s5>16</s5>
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<fC03 i1="16" i2="X" l="SPA"><s0>Solución sólida</s0>
<s5>16</s5>
</fC03>
<fC03 i1="17" i2="3" l="FRE"><s0>Alliage base bismuth</s0>
<s2>NK</s2>
<s5>17</s5>
</fC03>
<fC03 i1="17" i2="3" l="ENG"><s0>Bismuth base alloys</s0>
<s2>NK</s2>
<s5>17</s5>
</fC03>
<fC03 i1="18" i2="X" l="FRE"><s0>Etain alliage</s0>
<s5>18</s5>
</fC03>
<fC03 i1="18" i2="X" l="ENG"><s0>Tin alloy</s0>
<s5>18</s5>
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<fC03 i1="18" i2="X" l="GER"><s0>Zinnlegierung</s0>
<s5>18</s5>
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<fC03 i1="18" i2="X" l="SPA"><s0>Estaño aleación</s0>
<s5>18</s5>
</fC03>
<fC03 i1="19" i2="X" l="FRE"><s0>Point fusion</s0>
<s5>29</s5>
</fC03>
<fC03 i1="19" i2="X" l="ENG"><s0>Melting point</s0>
<s5>29</s5>
</fC03>
<fC03 i1="19" i2="X" l="GER"><s0>Schmelztemperatur</s0>
<s5>29</s5>
</fC03>
<fC03 i1="19" i2="X" l="SPA"><s0>Punto fusión</s0>
<s5>29</s5>
</fC03>
<fC03 i1="20" i2="X" l="FRE"><s0>Durcissement</s0>
<s5>30</s5>
</fC03>
<fC03 i1="20" i2="X" l="ENG"><s0>Hardening</s0>
<s5>30</s5>
</fC03>
<fC03 i1="20" i2="X" l="GER"><s0>Haerten</s0>
<s5>30</s5>
</fC03>
<fC03 i1="20" i2="X" l="SPA"><s0>Endurecimiento</s0>
<s5>30</s5>
</fC03>
<fC03 i1="21" i2="X" l="FRE"><s0>Renforcement mécanique</s0>
<s5>31</s5>
</fC03>
<fC03 i1="21" i2="X" l="ENG"><s0>Strengthening</s0>
<s5>31</s5>
</fC03>
<fC03 i1="21" i2="X" l="SPA"><s0>Refuerzo mecánico</s0>
<s5>31</s5>
</fC03>
<fC03 i1="22" i2="X" l="FRE"><s0>Constante élasticité</s0>
<s5>32</s5>
</fC03>
<fC03 i1="22" i2="X" l="ENG"><s0>Elastic constant</s0>
<s5>32</s5>
</fC03>
<fC03 i1="22" i2="X" l="GER"><s0>Elastizitaetskonstante</s0>
<s5>32</s5>
</fC03>
<fC03 i1="22" i2="X" l="SPA"><s0>Constante elasticidad</s0>
<s5>32</s5>
</fC03>
<fC03 i1="23" i2="X" l="FRE"><s0>Frottement interne</s0>
<s5>33</s5>
</fC03>
<fC03 i1="23" i2="X" l="ENG"><s0>Internal friction</s0>
<s5>33</s5>
</fC03>
<fC03 i1="23" i2="X" l="GER"><s0>Innere Reibung</s0>
<s5>33</s5>
</fC03>
<fC03 i1="23" i2="X" l="SPA"><s0>Frotamiento interno</s0>
<s5>33</s5>
</fC03>
<fC03 i1="24" i2="X" l="FRE"><s0>Propriété thermique</s0>
<s5>34</s5>
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<fC03 i1="24" i2="X" l="ENG"><s0>Thermal properties</s0>
<s5>34</s5>
</fC03>
<fC03 i1="24" i2="X" l="GER"><s0>Thermische Eigenschaft</s0>
<s5>34</s5>
</fC03>
<fC03 i1="24" i2="X" l="SPA"><s0>Propiedad térmica</s0>
<s5>34</s5>
</fC03>
<fC03 i1="25" i2="3" l="FRE"><s0>Effet contrainte</s0>
<s5>35</s5>
</fC03>
<fC03 i1="25" i2="3" l="ENG"><s0>Stress effects</s0>
<s5>35</s5>
</fC03>
<fC03 i1="26" i2="X" l="FRE"><s0>Relation composition propriété</s0>
<s5>36</s5>
</fC03>
<fC03 i1="26" i2="X" l="ENG"><s0>Property composition relationship</s0>
<s5>36</s5>
</fC03>
<fC03 i1="26" i2="X" l="SPA"><s0>Relación composición propiedad</s0>
<s5>36</s5>
</fC03>
<fC03 i1="27" i2="X" l="FRE"><s0>Substrat indium</s0>
<s4>INC</s4>
<s5>46</s5>
</fC03>
<fC03 i1="28" i2="X" l="FRE"><s0>Ag3Sn</s0>
<s4>INC</s4>
<s5>47</s5>
</fC03>
<fC03 i1="29" i2="X" l="FRE"><s0>8140L</s0>
<s4>INC</s4>
<s5>65</s5>
</fC03>
<fC03 i1="30" i2="X" l="FRE"><s0>8130F</s0>
<s4>INC</s4>
<s5>72</s5>
</fC03>
<fC03 i1="31" i2="X" l="FRE"><s0>Brasure sans plomb</s0>
<s4>CD</s4>
<s5>96</s5>
</fC03>
<fC03 i1="31" i2="X" l="ENG"><s0>Lead free solder</s0>
<s4>CD</s4>
<s5>96</s5>
</fC03>
<fN21><s1>007</s1>
</fN21>
</pA>
</standard>
</inist>
</record>

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Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys

Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi-Sn based lead-free solder alloys

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